The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2024

Filed:

May. 07, 2018
Applicants:

Case Western Reserve University, Cleveland, OH (US);

The University of Chicago, Chicago, IL (US);

Inventors:

Stuart J. Rowan, Chicago, IL (US);

Elvis Cudjoe, Cleveland Heights, OH (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 101/08 (2006.01); B82Y 30/00 (2011.01); B82Y 40/00 (2011.01); C09J 181/04 (2006.01);
U.S. Cl.
CPC ...
C09J 101/08 (2013.01); C09J 181/04 (2013.01); B82Y 30/00 (2013.01); B82Y 40/00 (2013.01);
Abstract

A dynamic cross-linked polymer nanocomposite adhesive has been developed by the oxidation of a thiol functionalized semi-crystalline and/or amorphous oligomer and thiol functionalized Cellulose Nanocrystals (CNCs) to form a polydisulfide network. The resulting solid material has a melting point transition at ca. 75° C. which corresponds to the melting of the semi-crystalline and/or amorphous phase of the nanocomposite adhesive. At higher temperatures (ca. 150° C.), results in the dynamic behavior of the disulfide bond being induced, where the bonds break and reform. Two levels of adhesion are obtained, in some embodiment by (1) heating the adhesive material to 80° C. (melting the semi-crystalline and/or amorphous phase) resulting in a lower modulus/viscosity of the adhesive, thus allowing better surface wetting on a substrate and (2) heating the adhesive material to 150° C. (inducing dynamic behavior of disulfide bonds), further lowers the modulus/viscosity of the adhesive ensuring a much better surface wetting and stronger adhesive bond. The polymer adhesive has been demonstrated to bind to, relatively high surface energy substrates including metal and hydrophilic glass, and to low surface energy substrates such as hydrophobic glass.


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