The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2024
Filed:
Mar. 18, 2020
Applicant:
Daicel Corporation, Osaka, JP;
Inventor:
Yuichi Sakanishi, Tokyo, JP;
Assignee:
DAICEL CORPORATION, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/04 (2006.01); C08G 65/00 (2006.01); C08L 71/02 (2006.01); C08L 71/08 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
C09G 1/04 (2013.01); C08G 65/00 (2013.01); C08L 71/02 (2013.01); C08L 71/08 (2013.01); H01L 21/3212 (2013.01); C08G 2650/54 (2013.01);
Abstract
Provided is a hydrophilization treatment liquid for a semiconductor wafer surface, the hydrophilization treatment liquid being capable of imparting hydrophilicity to the semiconductor wafer surface. A hydrophilization treatment liquid for a semiconductor wafer surface, the hydrophilization treatment liquid comprising water and a compound represented by Formula (1) below, and a total content of the water and the compound represented by Formula (1) below being 95 wt. % or greater.RO—(CHO)—H (1)