The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2024
Filed:
Apr. 06, 2021
Applicant:
Mitsubishi Chemical Corporation, Tokyo, JP;
Inventors:
Yosuke Tsuge, Tokyo, JP;
Kotaro Nozawa, Tokyo, JP;
Kenta Yamamoto, Tokyo, JP;
Hayato Ogasawara, Tokyo, JP;
Assignee:
Mitsubishi Chemical Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C08L 61/30 (2006.01); C08L 63/00 (2006.01); C08G 59/24 (2006.01); C08G 59/50 (2006.01);
U.S. Cl.
CPC ...
C08L 61/30 (2013.01); C08L 63/00 (2013.01); C08G 59/245 (2013.01); C08G 59/5073 (2013.01); C08L 2203/20 (2013.01);
Abstract
A curable resin composition includes a polyether polyol resin represented by general formula (1) and having an epoxy equivalent of 7,000 to 100,000 g/eq, an epoxy resin having a functionality of 3 or more, and an epoxy resin curing agent. Provided is a curable resin composition that is excellent in heat resistance and also excellent in bending resistance in a well-balanced manner and that is applicable in various fields that require heat resistance and toughness, particularly, electrical and electronic fields.