The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2024

Filed:

Apr. 01, 2021
Applicant:

Jiaxing Super Lighting Electric Appliance Co., Ltd, Jiaxing, CN;

Inventors:

Yukihiro Saito, Jiaxing, CN;

Hayato Unagiike, Jiaxing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/56 (2010.01); C08G 73/10 (2006.01); C08G 77/455 (2006.01); C08L 79/08 (2006.01); C08L 83/10 (2006.01);
U.S. Cl.
CPC ...
C08G 73/106 (2013.01); C08G 77/455 (2013.01); C08L 79/08 (2013.01); C08L 83/10 (2013.01);
Abstract

The present disclosure discloses an LED filament, comprising a plurality of LED chips; at least two electrodes, each of the at least two electrodes is connected to at least one of the plurality of LED chips; and a light conversion layer comprising a top layer and a base layer, coated on at least two sides of the at least two electrodes, and a portion of the at least two electrodes is exposed by the light conversion layer, where the top layer and the base layer are located at two sides of the plurality of LED chips, respectively, wherein the base layer comprising an organosilicon-modified polyimide, a thermal curing agent and fluorescent powders. The present disclosure further discloses an LED light bulb. The base layer of the present disclosure has superior transmittance, heat resistance and mechanical strength, and is suitable for producing a flexible LED filament.


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