The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2024
Filed:
Jul. 22, 2020
Canon Kabushiki Kaisha, Tokyo, JP;
Kazunari Ishizuka, Suntou-gun, JP;
Isamu Horiuchi, Yokohama, JP;
Satoshi Tsutsui, Yokohama, JP;
Yohei Hamade, Tokyo, JP;
Miho Ishii, Kawasaki, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
Provided is a method for manufacturing a liquid ejection head including an ejection orifice for ejecting a liquid, a substrate and a flow path forming member that is joined to the substrate to form a liquid flow path communicating with the ejection orifice, the method including: (1) forming a resin layer having a flow path mold pattern, on the substrate; (2) adding a hydrophilizing material represented by Chemical Formula 1 to an entire surface layer of the resin layer; (3) forming a covering resin layer serving as the flow path forming member, on the resin layer and forming a compatible layer containing the resin layer, the covering resin layer and the hydrophilizing material, at an interface between the resin layer and the covering resin layer; (4) forming the ejection orifice by exposing the covering resin layer; and (5) forming a flow path by removing the resin layer.