The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2024

Filed:

Jan. 19, 2022
Applicant:

The Boeing Company, Chicago, IL (US);

Inventors:

Marcin A. Rabiega, Everett, WA (US);

Kevin L Braun, Seattle, WA (US);

Jason R. Grindon, Mukilteo, WA (US);

Yaniv R. Rock, Seattle, WA (US);

John C. Osborne, Seattle, WA (US);

Assignee:

The Boeing Company, Arlington, VA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 70/68 (2006.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 80/00 (2015.01); B29C 64/386 (2017.01); B29C 64/393 (2017.01); B29L 31/30 (2006.01); B33Y 50/00 (2015.01); B33Y 50/02 (2015.01);
U.S. Cl.
CPC ...
B29C 70/682 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 80/00 (2014.12); B29C 64/386 (2017.08); B29C 64/393 (2017.08); B29L 2031/3082 (2013.01); B33Y 50/00 (2014.12); B33Y 50/02 (2014.12);
Abstract

In an example, a method of shimming an uncured substructure for assembly is disclosed. The method comprises emitting a signal from an inspection system proximate a mating surface of the substructure, detecting a reflection of the signal with the inspection system, generating a data set based on detecting the reflection of the signal, the data set representing a shape of the mating surface, determining distances between a plurality of points on the mating surface and respective points on an inner surface of a support structure based on the data set, generating filler dimension data based on the distances, wherein the filler dimension data includes a varying thickness, shaping a filler structure with a computer numerical controlled shaping device using the filler dimension data, adhering a first surface of the filler structure to the mating surface of the substructure to form a shimmed substructure subassembly, and curing the shimmed substructure subassembly.


Find Patent Forward Citations

Loading…