The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2024
Filed:
Jun. 06, 2019
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Yuichi Yui, Tokyo, JP;
Akihisa Okuda, Tokyo, JP;
Masahiko Shimizu, Tokyo, JP;
Yuki Kani, Tokyo, JP;
Akihiro Terasaka, Tokyo, JP;
MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;
Abstract
A composite material molding method includes a first disposition step for disposing a prepreg on a jig molding surface of a molding jig; a first sealing step for airtightly sealing the prepreg by covering the prepreg with a first resin bag; a second disposition step for disposing a breather so as to cover the first resin bag; a second sealing step for airtightly sealing the breather so as to cover the breather with a second resin bag; a first depressurization step for depressurizing a first space sealed by the first resin bag; a second depressurization step for depressurizing a second space sealed by the second resin bag; and a heat-curing step for heat-curing the prepreg by supplying the internal space of a pressure vessel with a steam with a predetermined temperature and a predetermined pressure.