The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2024
Filed:
Jan. 14, 2020
Applicant:
Tyco Electronics Raychem Gmbh, Ottobrunn, DE;
Inventors:
Thilo Simonsohn, Munich, DE;
Christian Heindl, Munich, DE;
Assignee:
TYCO ELECTRONICS RAYCHEM GMBH, Ottobrunn, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 63/42 (2006.01); B29C 61/06 (2006.01); H02G 15/18 (2006.01);
U.S. Cl.
CPC ...
B29C 61/0625 (2013.01); B29C 63/42 (2013.01); H02G 15/1806 (2013.01);
Abstract
A heating system for heating a heat shrink layer of a heat shrink component during a heat shrink process includes a heating unit arranged in thermal contact with at least a part of the heat shrink layer and heating the heat shrink layer to a heat shrink temperature. The heating unit has a first heating zone and a second heating zone. The first heating zone has a different heating energy than the second heating zone for a period of time of the heat shrink process.