The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2024

Filed:

Sep. 22, 2022
Applicants:

Kobe Steel, Ltd., Hyogo, JP;

Rapiit Co., Ltd., Okayama, JP;

Inventors:

Kenichi Watanabe, Kobe, JP;

Ryohei Ihara, Kobe, JP;

Zenzo Yamaguchi, Kobe, JP;

Takuro Shigetomo, Okayama, JP;

Assignees:

KOBE STEEL, LTD., Hyogo, JP;

RAPIIT CO., LTD., Okayama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 43/18 (2006.01); B29C 43/36 (2006.01); B29C 43/52 (2006.01); B29L 31/30 (2006.01);
U.S. Cl.
CPC ...
B29C 43/18 (2013.01); B29C 43/36 (2013.01); B29C 43/52 (2013.01); B29C 2043/185 (2013.01); B29C 2043/189 (2013.01); B29L 2031/3002 (2013.01);
Abstract

An apparatus for manufacturing a metal-resin composite by press molding includes upper and lower molds sandwiching a metal member and a resin material, a molding auxiliary component detachably fixed to the upper mold to fill part of a cavity for the resin material between the upper and lower molds, and a drive unit that vertically moves at least one of the upper and lower molds. The molding auxiliary component has a first press surface for molding the metal member. The upper mold has a second press surface for integrally molding the metal member and the resin material when the molding auxiliary component is removed. The upper and lower molds are for pressing the resin material between the second press surface and the lower mold to cause the resin to flow to fill the cavity with the resin material when the molding auxiliary component is removed.


Find Patent Forward Citations

Loading…