The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2024
Filed:
Aug. 14, 2020
Applicant:
Olympus Corporation, Hachioji, JP;
Inventor:
Tsunetaka Akagane, Hachioji, JP;
Assignee:
OLYMPUS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 5/00 (2006.01); A61B 17/32 (2006.01); B29C 37/00 (2006.01); B29C 45/14 (2006.01); A61B 17/00 (2006.01); B29K 71/00 (2006.01); B29K 509/08 (2006.01); B29K 509/10 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B29C 37/0028 (2013.01); A61B 17/320092 (2013.01); B29C 45/14008 (2013.01); A61B 2017/00526 (2013.01); B29C 2037/0035 (2013.01); B29K 2071/00 (2013.01); B29K 2509/08 (2013.01); B29K 2509/10 (2013.01); B29L 2031/7546 (2013.01);
Abstract
A method of manufacturing an ultrasound probe includes: forming a probe body; forming a coating portion by applying a liquid containing a resin component as a main component and a filler to a predetermined region on an outer surface of the probe body and heating the liquid; and forming a mold portion by placing the probe body on which the coating portion is formed in a die and pouring a resin containing a same component as the resin component serving as the main component of the coating portion in the die.