The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2024

Filed:

Apr. 17, 2019
Applicant:

Taiyo Nippon Sanso Corporation, Tokyo, JP;

Inventors:

Yusuke Yamaguchi, Tokyo, JP;

Toyoyuki Sato, Tokyo, JP;

Tomoaki Sasaki, Tokyo, JP;

Hiroki Amano, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 3/10 (2006.01); B22F 10/00 (2021.01); B23K 26/12 (2014.01); B23K 26/342 (2014.01); B33Y 10/00 (2015.01);
U.S. Cl.
CPC ...
B22F 3/1007 (2013.01); B22F 10/00 (2021.01); B23K 26/123 (2013.01); B23K 26/342 (2015.10); B33Y 10/00 (2014.12); B22F 2201/12 (2013.01);
Abstract

An object of the present invention is to provide a method for manufacturing a metal printed object that can reduce the generation of sputters, and the present invention provides a method for manufacturing a metal printed object in which, in the presence of a shielding gas supplied around metal powder in a chamber, heat is supplied to the metal powder using energy rays to form a metal layer and laminate the metal layer, wherein the mass per unit volume of the shielding gas at a temperature of 25° C. and a pressure of 0.1 MPa is 1.30×10g/cmor less.


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