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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12058921 B1

PDFFull Text
Date of Patent:
Aug. 06, 2024

Filed:

Aug. 06, 2020

Display module and cutting method thereof, display device

Applicants:

Chengdu Boe Optoelectronics Technology Co., Ltd., Sichuan, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Huan Wu, Beijing, CN;

Meishan Xu, Beijing, CN;

Wanbin Li, Beijing, CN;

Jie Xiang, Beijing, CN;

Ruqin Zhang, Beijing, CN;

Mengyang Xian, Beijing, CN;

Assignees:

BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., Sichuan, CN;

BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;

Attorneys:

Nath, Goldberg & Meyer

Joshua B. Goldberg

Primary Examiner:

Victoria K Hall

Int. Cl.
CPC ...
H01L 51/56 (2006.01); B23K 26/38 (2014.01); B23K 26/70 (2014.01); H01L 27/32 (2006.01); H01L 51/52 (2006.01); H10K 50/844 (2023.01); H10K 59/40 (2023.01); H10K 59/65 (2023.01); H10K 59/80 (2023.01); H10K 71/00 (2023.01);
U.S. Cl.
CPC ...
H10K 71/00 (2023.02); B23K 26/38 (2013.01); B23K 26/70 (2015.10); B23K 26/702 (2015.10); H10K 50/844 (2023.02); H10K 59/40 (2023.02); H10K 59/65 (2023.02); H10K 59/87 (2023.02); H10K 59/873 (2023.02); H10K 71/851 (2023.02);
Abstract

The present disclosure provides a cutting method of a display module, including: providing a display module to be cut, the display module to be cut including a display panel and a spacing layer on the display panel, and the display panel including a region to be cut, the spacing layer being provided with a first through hole exposing the region to be cut, and the first through hole being provided therein with an encapsulation adhesive; and performing laser cutting on the display module to be cut at a position of the region to be cut so as to remove the region to be cut to form a cutting groove. In the laser cutting, at least part of the encapsulation adhesive is melted and covers a sidewall of the cutting groove.

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