The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2024

Filed:

Nov. 14, 2019
Applicant:

Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;

Inventors:

Rintaro Ishii, Ageo, JP;

Takenori Yanai, Ageo, JP;

Yoshinori Matsuura, Ageo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); B32B 9/00 (2006.01); B32B 9/04 (2006.01); B32B 15/04 (2006.01); H05K 1/09 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4652 (2013.01); B32B 9/007 (2013.01); B32B 9/041 (2013.01); B32B 15/043 (2013.01); H05K 1/09 (2013.01); H05K 3/388 (2013.01); B32B 2307/748 (2013.01); B32B 2457/08 (2013.01); H05K 2201/0355 (2013.01);
Abstract

There is provided a laminate in which a decrease in the release function of a release layer can be suppressed even when the laminate is heat-treated under either temperature condition of low temperature and high temperature. This laminate includes a carrier; an adhesion layer on the carrier and containing a metal Mhaving a negative standard electrode potential; a release-assisting layer on a surface of the adhesion layer opposite to the carrier and containing a metal M(Mis a metal other than an alkali metal and an alkaline earth metal); a release layer on a surface of the release-assisting layer opposite to the adhesion layer; and a metal layer on a surface of the release layer opposite to the release-assisting layer, and T/T, a ratio of a thickness of the release-assisting layer, T, to a thickness of the adhesion layer, T, is more than 1 and 20 or less.


Find Patent Forward Citations

Loading…