The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2024

Filed:

Nov. 16, 2021
Applicants:

Chengdu Boe Optoelectronics Technology Co., Ltd., Sichuan, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Qianlin Pu, Beijing, CN;

Fei Li, Beijing, CN;

Zijian Wang, Beijing, CN;

Xu Lu, Beijing, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0218 (2013.01); H05K 1/028 (2013.01); H05K 1/144 (2013.01); H05K 2201/043 (2013.01);
Abstract

A circuit board and an electronic device, the circuit board includes a first wiring board including a first substrate and a first wiring layer disposed on a first side surface of the first substrate, and the first wiring layer includes a first ground wiring; the circuit board further includes a first protective layer and a first electromagnetic interference shielding layer sequentially stacked on a side of the first wiring layer away from the first substrate; the first protective layer has a first opening exposing at least a portion of a first ground wiring, the first opening is filled with a first conductive material, height difference between a surface of the first conductive material and a surface of the first protective layer away from the first substrate ranges from 0 to 2 microns, and the first conductive material connects the first electromagnetic interference shielding layer to the first grounding wiring.


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