The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2024

Filed:

Mar. 11, 2022
Applicant:

Skyworks Solutions, Inc., Irvine, CA (US);

Inventors:

Shaul Branchevsky, Mission Viejo, CA (US);

Howard E. Chen, Anaheim, CA (US);

Anthony James Lobianco, Irvine, CA (US);

Assignee:

Skyworks Solutions, Inc., Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 23/00 (2006.01); H01L 23/06 (2006.01); H01L 23/15 (2006.01); H01L 23/29 (2006.01); H01L 23/50 (2006.01); H01L 23/552 (2006.01); H01L 23/60 (2006.01); H01L 23/66 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/12 (2006.01); H05K 3/20 (2006.01); H05K 3/22 (2006.01); H05K 3/40 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0216 (2013.01); H01L 23/06 (2013.01); H01L 23/552 (2013.01); H01L 24/94 (2013.01); H05K 1/0215 (2013.01); H05K 1/0218 (2013.01); H05K 1/0298 (2013.01); H05K 1/0306 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); H05K 3/005 (2013.01); H05K 3/1241 (2013.01); H05K 3/22 (2013.01); H05K 3/403 (2013.01); H05K 3/429 (2013.01); H05K 3/4644 (2013.01); H01L 23/15 (2013.01); H01L 23/3121 (2013.01); H01L 23/49822 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19105 (2013.01); H05K 3/0052 (2013.01); H05K 3/4629 (2013.01); H05K 2201/0715 (2013.01); H05K 2201/0919 (2013.01); H05K 2201/09563 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10674 (2013.01);
Abstract

Devices and methods related to metallization of ceramic substrates for shielding applications. In some embodiments, a ceramic assembly includes a plurality of layers, the assembly including a boundary between a first region and a second region, the assembly further including a selected layer having a plurality of conductive features along the boundary, each conductive feature extending into the first region and the second region such that when the first region and the second region are separated to form their respective side walls, each side wall includes exposed portions of the conductive features capable of forming electrical connection with a conductive shielding layer.


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