The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2024

Filed:

Oct. 19, 2021
Applicant:

AU Optronics Corporation, Hsinchu, TW;

Inventors:

Chia-Hui Pai, Hsinchu, TW;

Wen-Hsien Tseng, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/44 (2010.01); H01L 23/00 (2006.01); H01L 33/38 (2010.01); H01L 33/62 (2010.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 33/44 (2013.01); H01L 24/95 (2013.01); H01L 24/98 (2013.01); H01L 33/38 (2013.01); H01L 33/62 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 25/0753 (2013.01); H01L 2224/2957 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/95001 (2013.01); H01L 2224/98 (2013.01);
Abstract

A light emitting diode includes a first semiconductor layer, a second semiconductor layer, a first pad, a second pad, and a protection bump. The first semiconductor layer and the second semiconductor layer are overlapping with each other. An area of a first surface of the first semiconductor layer is larger than an area of a second surface of the second semiconductor layer. The first surface faces the second surface. The first pad is electrically connected to the first semiconductor layer. The second pad is electrically connected to the second semiconductor layer. The protection bump is located between the first pad and the second pad.


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