The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2024

Filed:

Aug. 05, 2020
Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventor:

Jungyun Jo, Namyangju-si, KR;

Assignee:

SAMSUNG DISPLAY CO., LTD., Yongin-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/18 (2023.01); H10K 59/131 (2023.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); H01L 24/05 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 25/18 (2013.01); H10K 59/131 (2023.02); H01L 24/06 (2013.01); H01L 24/29 (2013.01); H01L 24/30 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05073 (2013.01); H01L 2224/05558 (2013.01); H01L 2224/05562 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/06131 (2013.01); H01L 2224/06135 (2013.01); H01L 2224/29013 (2013.01); H01L 2224/30131 (2013.01); H01L 2224/32014 (2013.01); H01L 2224/32105 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/3303 (2013.01); H01L 2224/33106 (2013.01); H01L 2224/33517 (2013.01); H01L 2224/83205 (2013.01); H01L 2224/83862 (2013.01);
Abstract

A display device includes a display substrate, a signal pad part, an insulating layer, a connection pad part, and an electronic component. The signal pad part includes first and second signal pad parts, which face each other in one direction. The insulating layer covers the signal pad part. The connection pad part is disposed on the insulating layer and includes a first connection pad part overlapping the first signal pad part and a second connection pad part. The second connection pad part is electrically connected to the first connection pad part and is in electrical contact with the second signal pad part through a contact hole defined in the insulating layer. The electronic component includes a bump that is in electrical contact with the first connection pad part. The first signal pad part includes a plurality of signal pad portions spaced apart from each other.


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