The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2024
Filed:
Nov. 30, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Jongeun Lee, Cheonan-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A wire bonding includes a capillary that extrudes a wire; a wire clamp assembly disposed on the capillary; a support disposed on the wire clamp assembly; a wire contact member; and a slide rail that provides a slide hole. The wire clamp assembly includes: a first member; a second member spaced apart from the first member; a first contact member coupled to the first member; and a second contact member coupled to the second member and spaced apart from the first contact member. The first member includes a first body that extends in a first direction and a first tilting member that extends at an acute angle relative to the first direction. The second member includes a second body that extends in the first direction and is spaced apart from the first body in a second direction a second tilting member.