The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2024
Filed:
Apr. 06, 2021
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Yusuke Yamakaji, Tokyo, JP;
Assignee:
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01R 12/75 (2011.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/3672 (2013.01); H01L 23/49838 (2013.01); H01R 12/75 (2013.01); H01L 2223/6661 (2013.01);
Abstract
A printed circuit board includes a printed board, a first integrated circuit chip, a connector, and a capacitor. The printed board includes a first ground pattern and a second ground pattern directly opposed to the first ground pattern. The second ground pattern is electrically connected with a chassis or connector ground wiring. The capacitor is connected to the first ground pattern and the second ground pattern and disposed on a straight line that defines the shortest distance between the first ground terminal and the second ground pattern.