The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2024

Filed:

Dec. 16, 2021
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Chanmin Jo, Incheon, KR;

Taeyoon Kim, Hwaseong-si, KR;

Seungki Nam, Seoul, KR;

Sungwook Moon, Yongin-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/48 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2023.01); H01L 25/18 (2023.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5386 (2013.01); H01L 21/486 (2013.01); H01L 25/0652 (2013.01); H01L 25/18 (2013.01); H01L 23/3675 (2013.01); H01L 23/49811 (2013.01); H01L 23/5384 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01);
Abstract

A semiconductor device includes pads of a first group and a plurality of first peripheral pads, which are adjacent to each other and spaced apart by a first horizontal gap in a first direction, and pads of a first group and a plurality of first peripheral pads, which are connected to each other and spaced apart by a first vertical gap, greater than the first horizontal gap, in a second direction. A plurality of first wiring patterns include first horizontal extension portions extending at an angle exceeding about 45 degrees with respect to the first direction within the first horizontal gap.


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