The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2024

Filed:

Mar. 24, 2022
Applicant:

Cisco Technology, Inc., San Jose, CA (US);

Inventors:

D. Brice Achkir, Livermore, CA (US);

Shobhana Ram Punjabi, San Jose, CA (US);

Jie Xue, Dublin, CA (US);

Assignee:

CISCO TECHNOLOGY, INC., San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49805 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01);
Abstract

A multi-layer substrate stacking a plurality of insulating substrates supports one or more devices. Each substrate includes a face supporting conductive traces and edges surrounding the face at a substantially perpendicular angle. The multi-layer substrate includes a ground plane on a first substrate and a power plane on a second substrate. The ground plane is connected to at least one ground pad disposed on a first edge of the first substrate, which provides a low inductance ground path to the ground plane. The power plane is connected to at least one power pad disposed on a second edge of the second substrate, which provides a low inductance power path to the power plane.


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