Semiconductor device and method for manufacturing semiconductor device

Abstract

A semiconductor device Aincludes a semiconductor elementA having an element obverse faceand an element reverse face, the element obverse facehaving an obverse face electrodeformed thereon and the element reverse facehaving a reverse face electrodeformed thereon, a conductive substrateA including an obverse faceA opposed to the element reverse face, and to which the reverse face electrodeis conductively bonded, a conductive substrateB including an obverse faceB and spaced from the conductive substrateA in a width direction x, and a lead memberextending in the width direction x, and electrically connecting the obverse face electrodeand the conductive substrateB. The lead memberis located ahead of the obverse faceB in the direction in which the obverse faceB is oriented, and bonded to the obverse face electrodevia a lead bonding layer. The conductive substrateA, the semiconductor elementA, and the lead bonding layeroverlap with the conductive substrateB, as viewed in the width direction x.