The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2024

Filed:

Jul. 22, 2022
Applicant:

Taiyo Yuden Co., Ltd., Tokyo, JP;

Inventors:

Shota Tanaka, Tokyo, JP;

Joji Kobayashi, Tokyo, JP;

Toshimitsu Kogure, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); B32B 38/04 (2006.01); C04B 35/462 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/224 (2006.01);
U.S. Cl.
CPC ...
H01G 4/30 (2013.01); B32B 38/04 (2013.01); C04B 35/462 (2013.01); H01G 4/012 (2013.01); H01G 4/1218 (2013.01); H01G 4/224 (2013.01); B32B 2038/042 (2013.01); C04B 2235/6562 (2013.01);
Abstract

A method for manufacturing a multilayer ceramic electronic device includes punching out a ceramic sheet by one of left and right side surfaces of a laminated body so as to form a side margin part on the one of the left and right side surfaces of said laminated body; and punching out another ceramic sheet by another of the left and right side surfaces of the laminated body so as to form a side margin part on the another of the left and right side surfaces of said laminated body, thereby forming a ceramic main body having the laminated body and the pair of side margin parts that respectively cover the left and right side surfaces of the laminated body. The width W is greater than the length L in the multilayer ceramic electronic device.


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