The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2024
Filed:
Jan. 14, 2022
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Jong Ho Lee, Suwon-si, KR;
Myung Chan Son, Suwon-si, KR;
Eun Jung Lee, Suwon-si, KR;
Jung Tae Park, Suwon-si, KR;
Min Woo Kim, Suwon-si, KR;
Chang Ho Seo, Suwon-si, KR;
Sung Soo Choi, Suwon-si, KR;
Sun Mi Kim, Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Abstract
A method for manufacturing a multilayer electronic component includes: preparing first ceramic green sheets on which first internal electrode patterns are formed spaced apart from each other and second ceramic green sheets on which second internal electrode patterns are formed spaced apart from each other; forming a ceramic green sheet stack by stacking the first ceramic green sheets and the second ceramic green sheets for the first internal electrode patterns and the second internal electrode patterns to be cross-stacked on each other; obtaining a multilayer body by cutting the ceramic green sheet stack to have a side surface to which distal edges of the first and second internal electrode patterns are exposed; adhering an adhesive layer to the side surface to which the distal edges of the first and second internal electrode patterns of the multilayer body are exposed; and peeling the adhesive layer from the side surface.