The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2024

Filed:

Jul. 15, 2020
Applicants:

Heraeus Deutschland Gmbh & Co. KG, Hanau, DE;

Heraeus Medical Components Llc, St. Paul, MN (US);

Inventors:

Jörg-Martin Gebert, Hanau, DE;

Paul Schuster, St. Paul, MN (US);

Lisa Meyer, Hanau, DE;

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D 3/06 (2006.01); A61B 5/00 (2006.01); A61B 5/1486 (2006.01); B05D 7/00 (2006.01); B05D 7/14 (2006.01); B05D 7/20 (2006.01); B23K 26/06 (2014.01); B23K 26/0622 (2014.01); B23K 26/352 (2014.01); B23K 26/36 (2014.01); H01B 1/02 (2006.01); H01B 13/00 (2006.01); H01B 13/34 (2006.01); B23K 26/402 (2014.01); B23K 101/32 (2006.01); B23K 101/34 (2006.01);
U.S. Cl.
CPC ...
H01B 13/003 (2013.01); A61B 5/14865 (2013.01); A61B 5/686 (2013.01); B05D 3/065 (2013.01); B05D 7/14 (2013.01); B05D 7/20 (2013.01); B05D 7/54 (2013.01); B23K 26/0622 (2015.10); B23K 26/0624 (2015.10); B23K 26/0626 (2013.01); B23K 26/355 (2018.08); B23K 26/36 (2013.01); H01B 1/02 (2013.01); H01B 13/348 (2013.01); A61B 2562/12 (2013.01); A61B 2562/125 (2013.01); B23K 26/402 (2013.01); B23K 2101/32 (2018.08); B23K 2101/34 (2018.08);
Abstract

One aspect relates to a process for preparing a processed filament, including provision of a filament, including a segment. At least in the segment, the filament includes a core, including a first metal, a first layer which is superimposed on the core, and includes a polymer, and a second layer which is superimposed on the first layer, and includes a second metal. The segment of the filament is processed by interaction of the segment with at least one beam of electromagnetic radiation of a first kind. The electromagnetic radiation of the first kind has a spectrum with a peak wavelength in the range from 430 to 780 nm. Further, one aspect relates to a processed filament, obtainable by the process; a filament; an electrical device, including at least a part of the processed filament.


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