The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2024

Filed:

Feb. 26, 2021
Applicant:

Honeywell International Inc., Charlotte, NC (US);

Inventors:

Robert Compton, Loretto, MN (US);

Chad Fertig, Bloomington, MN (US);

Jeffrey James Kriz, Eden Prairie, MN (US);

Assignee:

Honeywell International Inc., Charlotte, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05B 6/02 (2006.01); B81B 3/00 (2006.01); F28F 13/00 (2006.01);
U.S. Cl.
CPC ...
G05B 6/02 (2013.01); B81B 3/0021 (2013.01); F28F 13/00 (2013.01); B81B 2201/01 (2013.01); B81B 2201/018 (2013.01); B81B 2203/0181 (2013.01); B81B 2203/019 (2013.01); B81B 2203/05 (2013.01); B81B 2203/058 (2013.01); B81B 2207/01 (2013.01); B81B 2207/053 (2013.01); F28F 2013/008 (2013.01);
Abstract

A thermal metamaterial device comprises at least one MEMS thermal switch, including a substrate layer including a first material having a first thermal conductivity, and a thermal bus over a first portion of the substrate layer. The thermal bus includes a second material having a second thermal conductivity higher than the first thermal conductivity. An insulator layer is over a second portion of the substrate layer and includes a third material that is different from the first and second materials. A thermal pad is supported by a first portion of the insulator layer, the thermal pad including the second material and having an overhang portion located over a portion of the thermal bus. When a voltage is applied to the thermal pad, an electrostatic interaction occurs to cause a deflection of the overhang portion toward the thermal bus, thereby providing thermal conductivity between the thermal pad and the thermal bus.


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