The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2024
Filed:
Dec. 27, 2019
Applicant:
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Inventors:
Kumiko Hayashi, Annaka, JP;
Michihiro Sugo, Annaka, JP;
Assignee:
Shin-Etsu Chemical Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03F 7/075 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/30 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0757 (2013.01); G03F 7/162 (2013.01); G03F 7/20 (2013.01); G03F 7/30 (2013.01);
Abstract
A photosensitive resin composition comprising (A) a silicone skeleton-containing polymer, (B) a photoacid generator, and (C) a peroxide is coated to form a photosensitive resin coating which is unsusceptible to plastic deformation while maintaining flexibility. A pattern forming process using the composition is also provided.
Hayashi, Kumiko. (2024). Photosensitive resin composition, laminate, and pattern forming process (U.S. Patent No. 12055853). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12055853
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile