The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2024

Filed:

Feb. 18, 2021
Applicant:

Rosemount Aerospace Inc., Burnsville, MN (US);

Inventors:

Robin Jacob, Karnataka, IN;

Guru Prasad Mahapatra, Karnataka, IN;

Paul Robert Johnson, Prior Lake, MN (US);

Greg Seidel, Farmington, MN (US);

Assignee:

ROSEMOUNT AEROSPACE INC., Burnsville, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01P 5/165 (2006.01); B22F 10/00 (2021.01); B22F 10/25 (2021.01); G01F 1/46 (2006.01); G01K 13/02 (2021.01); G01P 1/02 (2006.01); G01P 13/02 (2006.01); H01C 17/28 (2006.01); B22F 5/10 (2006.01); B22F 7/06 (2006.01); B29C 64/153 (2017.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01); C22C 1/04 (2023.01);
U.S. Cl.
CPC ...
G01P 5/165 (2013.01); B22F 10/00 (2021.01); B22F 10/25 (2021.01); G01F 1/46 (2013.01); G01K 13/028 (2013.01); G01P 1/026 (2013.01); G01P 13/025 (2013.01); H01C 17/28 (2013.01); B22F 5/106 (2013.01); B22F 7/062 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); B29C 64/153 (2017.08); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); C22C 1/0425 (2013.01); C22C 1/0433 (2013.01);
Abstract

An air data probe includes a probe body including a probe wall. The probe body is formed from a first material by direct energy metal deposition. An insert is positioned in the probe wall. The insert is formed from a second material different from the first material. The insert is encapsulated in the probe wall via the direct energy metal deposition. A method of forming an air data probe includes forming one or more thermally conductive inserts, and encapsulating the one or more inserts into a wall of an air data probe via direct energy metal deposition. The air data probe is formed from a first material and the one or more inserts are formed from a second material different from the first material.


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