The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2024

Filed:

Jan. 18, 2019
Applicant:

Koa Corporation, Ina, JP;

Inventors:

Hirotoshi Aoki, Ina, JP;

Koichi Hirasawa, Ina, JP;

Assignee:

KOA Corporation, Nagano, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 25/18 (2006.01); G01K 7/42 (2006.01); G01N 27/18 (2006.01); G06F 30/20 (2020.01); G06F 30/367 (2020.01); G06F 119/08 (2020.01);
U.S. Cl.
CPC ...
G01N 25/18 (2013.01); G01K 7/427 (2013.01); G01N 27/18 (2013.01); G06F 30/20 (2020.01); G06F 30/367 (2020.01); G06F 2119/08 (2020.01);
Abstract

A thermal analysis model includes an intermediate node that imitates an intermediate portion and a first thermal resistance connecting to the intermediate node, and imitates the terminal portions on both sides. A terminal portion inside node connected to the first thermal resistance is configured to imitate an inside area adjacent to the intermediate portion and serves as a starting point of a first heat dissipation path to the substrate. A terminal outside node is configured to imitate an outside area separated from the intermediate portion and adjacent to the inside area in the terminal portions and serves as a starting point of a second heat dissipation path to the substrate. A second thermal resistance connects the terminal portion inside node and the terminal portion outside node and is arranged parallel to a different element imitating a thermal resistance of an electrode layer in a surface of the substrate.


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