The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2024

Filed:

Mar. 20, 2023
Applicant:

Northwestern University, Evanston, IL (US);

Inventors:

Lingqiao Li, Houston, TX (US);

Xi Chen, Evanston, IL (US);

John M. Torkelson, Skokie, IL (US);

Assignee:

Northwestern University, Evanston, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 165/02 (2006.01); C08J 5/18 (2006.01);
U.S. Cl.
CPC ...
C09J 165/02 (2013.01); C08J 5/18 (2013.01); C08J 2365/02 (2013.01);
Abstract

Curable compositions for dynamic epoxy-based thermoset adhesives and/or sealants are provided. Methods of applying the compositions to form strong, low-stress, cured adhesive polymer films are also provided. The cured polymer films use crosslinkers that include disulfide and carbon-nitrogen bonds, wherein the disulfide bonds impart dynamic chemistry to the polymer network structure in order to the achieve adaptable thermoset adhesives and sealants.


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