The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2024

Filed:

Sep. 29, 2021
Applicant:

Taiwan Aerogel Technology Material Co., Ltd., Tainan, TW;

Inventors:

Jean-Hong Chen, Tainan, TW;

Shiu-Shiu Chen, Tainan, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C08G 73/10 (2006.01); B01J 13/00 (2006.01); C08G 85/00 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
C08G 73/10 (2013.01); B01J 13/0091 (2013.01); C08G 85/004 (2013.01); H01L 21/02126 (2013.01); H01L 21/02282 (2013.01); C08G 2110/0091 (2021.01);
Abstract

Manufacturing a low-K dielectric organic/inorganic aerogel composite material and its application are provided. The manufacturing method comprises: (1) mixing; (2) hydrolysis; (3) condensation; (4) aging; (5) drying; (6) impregnating polymer solution; (7) phase separation and drying; and (8) cross-linking and curing. The manufacturing method can produce a low-K dielectric organic/inorganic aerogel composite material having a high strength. The low-K dielectric aerogel is in a porous structure, and its porosity is higher than 70% and its density is from 0.12 g/cmto 0.45 g/cm. The dielectric property of the low-K dielectric aerogel decreases along with an increase of its porosity, wherein a dielectric constant thereof is from 1.28 to 1.89, and a dielectric loss thereof is from 0.052 to 0.023. The low-k dielectric aerogel can be used for a dielectric layer in a high-frequency circuit, an insulation layer in a semiconductor device or a microwave circuit in a communication integrated circuit.


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