The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2024

Filed:

Feb. 04, 2020
Applicant:

Kyoraku Co., Ltd., Kyoto, JP;

Inventors:

Ryohei Yuasa, Yamato, JP;

Takashi Nomura, Yamato, JP;

Assignee:

KYORAKU CO., LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/118 (2017.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); B29K 21/00 (2006.01);
U.S. Cl.
CPC ...
B29C 64/118 (2017.08); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); B29K 2021/003 (2013.01);
Abstract

The present invention provides a granular material for a fused deposition three-dimensional printer that enables a flexible molded object to be manufactured with high precision. According to the present invention, provided is a granular material for a fused deposition three-dimensional printer. The granular material is formed of a thermoplastic elastomer, and thermoplastic elastomer has a Shore A hardness of 0 to 10 and a melt flow rate of 10 to 200 g/10 min at least one of measurement temperatures of 120 to 230° C.


Find Patent Forward Citations

Yuasa, Ryohei. (2024). Granular material for heat-fusion type three-dimensional printers, method for manufacturing molded object, layered structure, and method for manufacturing layered structure (U.S. Patent No. 12053922). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12053922

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…