The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2024
Filed:
Jul. 14, 2021
Applicant:
Divergent Technologies, Inc., Los Angeles, CA (US);
Inventors:
Vivek R. Dave, Concord, NH (US);
Mark J. Cola, Santa Fe, NM (US);
Assignee:
DIVERGENT TECHNOLOGIES, INC., Los Angeles, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 31/12 (2006.01); B22F 10/28 (2021.01); B22F 10/31 (2021.01); B22F 10/366 (2021.01); B22F 10/38 (2021.01); B22F 12/41 (2021.01); B22F 12/49 (2021.01); B22F 12/90 (2021.01); B23K 26/03 (2006.01); B23K 26/342 (2014.01); B33Y 10/00 (2015.01); B33Y 50/02 (2015.01); B41M 5/26 (2006.01); G01J 5/00 (2022.01); G01J 5/04 (2006.01); G01J 5/07 (2022.01); G01J 5/48 (2022.01); G01J 5/80 (2022.01); G01K 11/00 (2006.01); G01N 25/72 (2006.01);
U.S. Cl.
CPC ...
B23K 31/125 (2013.01); B22F 10/28 (2021.01); B22F 10/366 (2021.01); B22F 10/38 (2021.01); B22F 12/41 (2021.01); B22F 12/90 (2021.01); B23K 26/034 (2013.01); B23K 26/342 (2015.10); B33Y 10/00 (2014.12); B33Y 50/02 (2014.12); B41M 5/262 (2013.01); G01J 5/04 (2013.01); G01J 5/07 (2022.01); G01K 11/00 (2013.01); G01N 25/72 (2013.01); B22F 10/31 (2021.01); B22F 12/49 (2021.01); G01J 2005/0077 (2013.01); G01J 5/48 (2013.01); G01J 5/80 (2022.01); Y02P 10/25 (2015.11);
Abstract
The disclosed embodiments relate to the monitoring and control of additive manufacturing. In particular, a method is shown for removing errors inherent in thermal measurement equipment so that the presence of errors in a product build operation can be identified and acted upon with greater precision. Instead of monitoring a grid of discrete locations on the build plane with a temperature sensor, the intensity, duration and in some cases position of each scan is recorded in order to characterize one or more build operations.