The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2024
Filed:
Dec. 21, 2021
Applicant:
Asca Gmbh, Kitzingen, DE;
Inventors:
Assignee:
ASCA GmbH, Kitzingen, DE;
Primary Examiner:
Int. Cl.
CPC ...
H10K 39/10 (2023.01); G06F 3/044 (2006.01); H10K 39/18 (2023.01); H10K 39/30 (2023.01); H10K 30/88 (2023.01); H10K 102/10 (2023.01);
U.S. Cl.
CPC ...
H10K 39/18 (2023.02); G06F 3/0445 (2019.05); H10K 39/30 (2023.02); H10K 30/88 (2023.02); H10K 2102/10 (2023.02);
Abstract
A semiconductor module has a layer structure and at least one capacitive sensor. The layer structure is formed with an upper electrode layer, a lower electrode layer, and an active layer arranged between the electrode layers. The active layer is made of a semiconductor material. The capacitive sensor has a measuring electrode which is integrated into the layer structure. There is also described a device which has such a semiconductor module and a method for producing such a semiconductor module.