The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2024
Filed:
Oct. 26, 2022
Canon Kabushiki Kaisha, Tokyo, JP;
Shinsaku Watanabe, Kanagawa, JP;
CANON KABUSHIKI KAISHA, Tokyo, JP;
Abstract
In an electronic apparatus using the Molded Interconnect Device technology, a circuit member includes a fastened portion, to which the fastening member is fixed, and a plurality of convex portions arranged in an approximately circular shape around the fastened portion as a center. Each of the plurality of convex portions has a first contact pattern. A substrate has a hole portion into which the fastening member is inserted. The substrate has a plurality of second contact patterns arranged in an approximately circular shape on the substrate around the hole portion as a center so that each of the second contact patterns faces a corresponding one of the first contact patterns. The first contact patterns and the second contact patterns are brought into contact with each other by fixing the fastening member to the fastened portion through the hole portion.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile