The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 30, 2024

Filed:

Jul. 21, 2020
Applicant:

Lumileds Llc, San Jose, CA (US);

Inventors:

Tze Yang Hin, Cupertino, CA (US);

Seng Huat Lau, Bayan Lepas, MY;

Hideo Kageyama, Santa Clara, CA (US);

Assignee:

LUMILEDS, LLC, San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/00 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2023.01); H01L 25/18 (2023.01); H01L 33/48 (2010.01); H01L 33/56 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 25/167 (2013.01); H01L 25/18 (2013.01); H01L 33/486 (2013.01); H01L 33/56 (2013.01); H01L 33/62 (2013.01); H01L 2224/73207 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92127 (2013.01);
Abstract

Light-emitting devices are described herein. A light-emitting device includes a hybridized device having a top surface and a bottom surface and a packaging substrate comprising a metal inlay in an opening in the packaging substrate and conductive vias. The metal inlay is thermally coupled to the bottom surface of the hybridized device. Conductive contacts are disposed on a bottom surface of the packaging substrate, each electrically coupled to one of the plurality of conductive vias. Conductive connectors electrically coupled between the top surface of the hybridized device and the top surface of the packaging substrate. Each of the conductive connectors is electrically coupled to a respective one of the conductive contacts on the bottom surface of the packaging substrate by a respective on of the conductive vias.


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