The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2024
Filed:
Dec. 15, 2020
Applicant:
Google Llc, Mountain View, CA (US);
Inventors:
Namhoon Kim, San Jose, CA (US);
Woon-Seong Kwon, Santa Clara, CA (US);
Teckgyu Kang, Saratoga, CA (US);
Assignee:
Google LLC, Mountain View, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/10 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 25/105 (2013.01); H01L 23/49822 (2013.01); H01L 23/49883 (2013.01); H01L 2225/1052 (2013.01); H01L 2225/107 (2013.01);
Abstract
The technology relates to an integrated circuit (IC) package in which an interconnection interface chiplet and/or interconnection interface circuit are relocated, partitioned, and/or decoupled from a main or core IC die and/or high-bandwidth memory (HBM) components in an integrated component package.