The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 30, 2024

Filed:

Sep. 09, 2019
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Jung Ju Lee, Seoul, KR;

Hoon Park, Seoul, KR;

Sa Rum Han, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 33/48 (2010.01); H01L 33/50 (2010.01); H01L 33/54 (2010.01); H01L 33/56 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 33/483 (2013.01); H01L 33/502 (2013.01); H01L 33/507 (2013.01); H01L 33/54 (2013.01); H01L 33/56 (2013.01); H01L 33/62 (2013.01);
Abstract

The lighting assembly disclosed in the embodiment of the invention includes a substrate, light emitting devices on the substrate, a first resin layer covering the light emitting devices, and at least one second resin layer on the first resin layer, and a first cover disposed on an outer periphery of the substrate along an outer periphery of the substrate of the lighting module. The second resin layer is disposed on upper and side surfaces of the first resin layer, and the second resin layer includes at least one of phosphor and ink particles. The first cover includes an opening portion from which the second resin layer protrudes, a substrate cover portion disposed on an upper surface of the substrate around the opening portion, and a side cover portion extending lower than a side surface of the substrate from the substrate cover portion. An upper surface of the substrate cover portion may be disposed lower than the upper surface of the first resin layer.


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