The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2024
Filed:
Sep. 01, 2023
Applicant:
Mts Ip Holdings Ltd, Grand Cayman, KY;
Inventors:
Luke Gregory, Mercer Island, WA (US);
Jimil Shah, Wylie, TX (US);
Ethan Schmitz, Saint Paul, MN (US);
Richard Eiland, Austin, TX (US);
Ioannis Manousakis, Zürich, CH;
Assignee:
MTS IP Holdings Ltd, Grand Cayman, KY;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 23/02 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); H01L 23/02 (2013.01); H01L 23/3107 (2013.01); H01L 23/3731 (2013.01); H01L 23/3736 (2013.01);
Abstract
Methods to form a boiling enhancement coating (BEC) directly on a protective lid or directly on a semiconductor die are described. The BEC can improve heat dissipation from the protective lid or semiconductor die into a coolant liquid of a two-phase immersion-cooling system. In some cases, a heat spreader is not needed to cool the semiconductor die.