The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2024
Filed:
Dec. 07, 2021
Samsung Electronics Co., Ltd., Suwon-si, KR;
Daisuke Nagatomo, Kanagawa, JP;
Fumitaka Moroishi, Kanagawa, JP;
Masanori Izumita, Kanagawa, JP;
Shinji Ueyama, Kanagawa, JP;
Takahiro Tokumiya, Kanagawa, JP;
Takamasa Sugiura, Kanagawa, JP;
Tatsuya Ishimoto, Kanagawa, JP;
Masato Kajinami, Kanagawa, JP;
Abstract
An apparatus for manufacturing a semiconductor device includes a bonding head configured to adsorb and hold a mounting component at a pick-up position, to move between the pick-up position and a mounting position, and to mount the mounting component on a substrate that is on a bonding stage; a camera configured to move together with the bonding head and to capture an image of the mounting component and an image of the substrate; an optical system configured to transmit light between the mounting component and the camera; a fiducial mark configured to move together with the camera in a capturing range of the camera; and a controller configured to correct a positional relationship between the mounting component and the substrate based on a first image including the fiducial mark and the mounting component and a second image including the fiducial mark and the substrate.