The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 30, 2024

Filed:

Sep. 21, 2021
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

David Charles Smith, Lake Oswego, OR (US);

Richard Wise, Los Gatos, CA (US);

Arpan Pravin Mahorowala, West Linn, OR (US);

Patrick A van Cleemput, Duvall, WA (US);

Bart J. van Schravendijk, Palo Alto, CA (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/033 (2006.01); C23C 16/40 (2006.01); C23C 16/455 (2006.01); C23C 16/56 (2006.01); H01J 37/32 (2006.01); H01L 21/02 (2006.01); H01L 21/027 (2006.01); H01L 21/311 (2006.01); H01L 21/3213 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0332 (2013.01); C23C 16/407 (2013.01); C23C 16/45542 (2013.01); C23C 16/45553 (2013.01); C23C 16/56 (2013.01); H01J 37/32091 (2013.01); H01L 21/02175 (2013.01); H01L 21/02274 (2013.01); H01L 21/0228 (2013.01); H01L 21/0271 (2013.01); H01L 21/0337 (2013.01); H01L 21/31111 (2013.01); H01L 21/31122 (2013.01); H01L 21/31144 (2013.01); H01L 21/32137 (2013.01); H01L 21/32139 (2013.01); H01L 21/67069 (2013.01); H01J 37/32862 (2013.01); H01J 2237/3321 (2013.01); H01J 2237/3341 (2013.01); H01J 2237/3342 (2013.01);
Abstract

Thin tin oxide films are used as spacers in semiconductor device manufacturing. In one implementation, formation of spacers involves deposition of a tin oxide layer on a semiconductor substrate having multiple protruding features. The deposition is performed in a deposition apparatus having a controller with program instructions configured to cause sequential contacting of the semiconductor substrate with a tin-containing precursor and an oxygen-containing precursor such as to coat the semiconductor substrate having the protruding features with a tin oxide layer. Next, tin oxide film is removed from horizontal surfaces, without being completely removed from the sidewalls of the protruding features. Next, the material of protruding features is etched away, leaving tin oxide spacers on the semiconductor substrate.


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