The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 30, 2024

Filed:

Jun. 05, 2019
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Nobuya Takahashi, Tokyo, JP;

Naoaki Fujii, Tokyo, JP;

Tomonaga Nishikawa, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01F 27/32 (2006.01); H01F 41/04 (2006.01); H01F 41/12 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 27/29 (2013.01); H01F 27/323 (2013.01); H01F 41/041 (2013.01); H01F 41/122 (2013.01); H01F 2027/2809 (2013.01);
Abstract

A coil component includes spiral conductor patterns Sand Sand insulating resin layers that cover the spiral conductor patterns Sand S, respectively. An outermost turn of the spiral conductor pattern Shas a widened part. As a result, an outer wall surface part constituting the outer wall surface of the outermost turn in the radial direction and an outer wall surface part constituting the outer wall surface of the outermost turn of the spiral conductor pattern Sin the radial direction differ in radial position from each other. Overlap of the insulating resin layers in the lamination direction is reduced to suppress thermal expansion or contraction of the insulating resin layers in the lamination direction at the overlap. This can relieve a stress applied to the interface between the spiral conductor pattern and the insulating resin layer.


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