The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 30, 2024

Filed:

Sep. 17, 2020
Applicant:

Te Connectivity Services Gmbh, Schaffhausen, CH;

Inventors:

Zachary Galbraith, Hummelstown, PA (US);

Christopher David Ritter, Hummelstown, PA (US);

Alex Michael Sharf, Harrisburg, PA (US);

Dean Marlin Harmon, III, Etters, PA (US);

Assignee:

TE CONNECTIVITY SOLUTIONS GmbH, Schaffhausen, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); H01R 12/71 (2011.01); H01R 12/72 (2011.01); H01R 13/6594 (2011.01); H05K 5/02 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4269 (2013.01); H01R 12/716 (2013.01); H01R 12/722 (2013.01); H01R 13/6594 (2013.01); H05K 5/0286 (2013.01); H05K 7/20418 (2013.01); H05K 7/20436 (2013.01);
Abstract

A pluggable module includes a housing having a top wall including an opening above a module cavity. The pluggable module includes a heat exchange assembly separate and discrete from the housing extending into the module cavity through the opening. The heat exchange assembly includes a thermal bridge having an upper thermal interface and a lower thermal interface. The thermal bridge includes a plurality of interleaved plates arranged in a plate stack with the plates being movable relative to each other in the plate stack. The lower thermal interface is in thermal communication with the electrical component to dissipate heat from the electrical component. The thermal bridge extends through the opening with the upper thermal interface exposed from above for dissipating heat from the heat exchange assembly.


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