The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 30, 2024

Filed:

Sep. 18, 2020
Applicant:

Stmicroelectronics S.r.l., Agrate Brianza, IT;

Inventors:

Gabriele Gattere, Castronno, IT;

Carlo Valzasina, Gessate, IT;

Enri Duqi, Milan, IT;

Assignee:

STMicroelectronics S.r.l., Agrate Brianza, IT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); G01B 7/16 (2006.01); G01L 1/14 (2006.01); H01G 5/01 (2006.01); H01G 5/16 (2006.01); H01H 1/00 (2006.01); H03K 17/975 (2006.01); G06F 3/044 (2006.01);
U.S. Cl.
CPC ...
G01B 7/22 (2013.01); B81B 7/0058 (2013.01); G01L 1/14 (2013.01); H01G 5/01 (2013.01); H01G 5/16 (2013.01); H01H 1/0036 (2013.01); H03K 17/975 (2013.01); B81B 2201/0221 (2013.01); B81B 2201/0292 (2013.01); B81B 2203/0154 (2013.01); B81B 2203/0181 (2013.01); B81B 2203/0307 (2013.01); B81B 2203/04 (2013.01); B81B 2203/056 (2013.01); B81B 2207/012 (2013.01); G06F 3/044 (2013.01);
Abstract

A button device includes a MEMS sensor having a MEMS strain detection structure and a deformable substrate configured to undergo deformation under the action of an external force. The MEMS strain detection structure includes a mobile element carried by the deformable substrate via at least a first and a second anchorage, the latter fixed with respect to the deformable substrate and configured to displace and generate a deformation force on the mobile element in the presence of the external force; and stator elements capacitively coupled to the mobile element. The deformation of the mobile element causes a capacitance variation between the mobile element and the stator elements. Furthermore, the MEMS sensor is configured to generate detection signals correlated to the capacitance variation.


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