The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 30, 2024

Filed:

Jun. 14, 2019
Applicant:

Posco, Pohang-si, KR;

Inventors:

Kwang-Min Kim, Pohang-si, KR;

Mi-Nam Park, Pohang-si, KR;

Bo-Sung Seo, Pohang-si, KR;

Assignee:

POSCO CO., LTD, Pohang-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 38/58 (2006.01); C21D 1/26 (2006.01); C22C 38/02 (2006.01); C22C 38/42 (2006.01); C22C 38/52 (2006.01); C23C 22/34 (2006.01);
U.S. Cl.
CPC ...
C22C 38/58 (2013.01); C21D 1/26 (2013.01); C22C 38/02 (2013.01); C22C 38/42 (2013.01); C23C 22/34 (2013.01); C21D 2211/001 (2013.01);
Abstract

The present disclosure relates to austenitic stainless steel with excellent electrical conductivity in which metal copper is formed in a non-conductive passivation film formed on the surface of stainless steel, and a method of manufacturing the same. The austenitic stainless steel with excellent electrical conductivity according to an embodiment of present disclosure includes: a stainless steel base material comprising, in percent (%) by weight of the entire composition, C: 0.1% or less, Si: 0.1 to 1.0% or less, Mn: 0.1 to 2.0% or less, Cr: 15 to 24% or less, Ni: 6 to 12% or less, Cu: 0.5 to 3% or less, the remainder of iron (Fe) and other inevitable impurities; and a passivation film formed on the stainless steel base material, and the passivation film has a thickness of more than 0 and less than or equal to 5 nm, the Cu weight % content in the thickness region between 2 to 3 nm from the surface of the passivation film is 1.5 or more compared to the Cu weight % content of the stainless steel base material.


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