The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 30, 2024

Filed:

Oct. 28, 2022
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Hidenobu Maruyama, Azumino, JP;

Kenta Anegawa, Matsumoto, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/13 (2006.01); B29C 45/04 (2006.01); B29C 45/40 (2006.01); B29C 45/74 (2006.01); B29C 45/78 (2006.01); B29K 101/10 (2006.01);
U.S. Cl.
CPC ...
B29C 45/13 (2013.01); B29C 45/04 (2013.01); B29C 45/401 (2013.01); B29C 45/74 (2013.01); B29C 45/78 (2013.01); B29C 2045/135 (2013.01); B29C 2945/76531 (2013.01); B29C 2945/76732 (2013.01); B29C 2945/76862 (2013.01); B29K 2101/10 (2013.01);
Abstract

An injection molding system includes a first unit that has a first injection molding machine configured to inject a first molding material into a first cavity partitioned by a first fixed mold and a movable mold, a second unit that includes a second injection molding machine configured to inject a second molding material into a second cavity partitioned by a second fixed mold and the movable mold, and a movement mechanism configured to, after the first molding material is injected into the first cavity, move the movable mold filled with the first molding material from the first injection molding machine to the second injection molding machine.


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