The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2024
Filed:
Oct. 10, 2019
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Akira Ikada, Tokyo, JP;
Michinobu Takahagi, Tokyo, JP;
Ryo Nakamura, Tokyo, JP;
Yuki Tsukioka, Tokyo, JP;
MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;
Abstract
The purpose of the present invention is to, after a through-hole is formed in a plurality of members between which a sealant is applied, rapidly and easily remove the sealant flowing into the through-hole. This through-hole forming method is provided with: a step (S) in which a cutting tool rotates about the axis thereof, thereby forming a through-hole in a plurality of members between which a sealant is provided; and a step (S) in which after the through-hole is formed, the cutting tool continues the rotation about the axis thereof for a predetermined time or a predetermined number of rotations, thereby removing the sealant flowing into the through-hole.