The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 30, 2024

Filed:

Nov. 14, 2019
Applicant:

Eth Zurich, Zurich, CH;

Inventors:

Hyung Gyu Park, Pohang, KR;

Roman Wyss, Zurich, CH;

Assignee:

ETH ZURICH, Zurich, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01D 69/12 (2006.01); B01D 67/00 (2006.01); B01D 69/02 (2006.01); B01D 69/10 (2006.01); B01D 71/02 (2006.01); G01N 27/40 (2006.01); G01N 27/41 (2006.01); G01N 27/414 (2006.01); H01M 4/66 (2006.01); H01M 4/80 (2006.01); H01M 8/02 (2016.01); H01M 8/0232 (2016.01);
U.S. Cl.
CPC ...
B01D 69/12 (2013.01); B01D 67/0072 (2013.01); B01D 69/02 (2013.01); B01D 69/10 (2013.01); B01D 71/022 (2013.01); G01N 27/40 (2013.01); G01N 27/414 (2013.01); H01M 4/661 (2013.01); H01M 4/80 (2013.01); H01M 8/0232 (2013.01); B01D 2323/02 (2013.01); B01D 2323/081 (2022.08); B01D 2323/64 (2022.08); B01D 2325/02 (2013.01); B01D 2325/04 (2013.01); Y02E 60/10 (2013.01); Y02E 60/50 (2013.01);
Abstract

The invention relates to a method for a fabrication of a pore comprising membrane and a pore comprising membrane. The pore comprising membrane () comprises at least a porous metallic layer () on a porous substrate (), wherein the porous metallic layer () is connected to the porous substrate () and the pores () of the metallic layer () overlap at least partially with the pores () of the porous substrate (). The method comprises at least the following steps: i) deposition of the metallic layer () onto a support material (), wherein the deposited metallic layer () forms a plurality of feedthroughs, in particular a percolation network on the support material (), ii) removal of the support material (), iii) connecting of the metallic layer () with the porous substrate () such that pores () of the metallic layer () overlap at least partially with the pores () of the porous substrate ().


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