The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2024
Filed:
May. 25, 2022
Applicant:
Teliatry, Inc., Richardson, TX (US);
Inventor:
Rahul Saini, Allen, TX (US);
Assignee:
Teliatry, Inc., Richardson, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61N 1/375 (2006.01); A61N 1/36 (2006.01); A61B 5/00 (2006.01); A61B 5/24 (2021.01); A61N 1/05 (2006.01); A61N 1/372 (2006.01);
U.S. Cl.
CPC ...
A61N 1/36071 (2013.01); A61N 1/3605 (2013.01); A61N 1/375 (2013.01); A61B 5/24 (2021.01); A61B 5/686 (2013.01); A61B 5/6868 (2013.01); A61B 5/6877 (2013.01); A61B 2562/125 (2013.01); A61N 1/0534 (2013.01); A61N 1/0551 (2013.01); A61N 1/36053 (2013.01); A61N 1/36067 (2013.01); A61N 1/37288 (2013.01); A61N 1/3758 (2013.01);
Abstract
Implantable devices are provided herein, along with methods of fabricated such implantable devices. An exemplary method of fabricating an implantable device includes coupling electronics to a conductive via at a first side of a first glass substrate. The conductive via extends from the first side through the first glass substrate to a second side of the first glass substrate. The method further includes attaching a second glass substrate to cap the first side of the first glass substrate and form a hermetically sealed chamber containing the electronics, rounding edges of the implantable device after attaching the cap.