The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2024
Filed:
Aug. 06, 2021
Applicant:
American Superconductor Corporation, Ayer, MA (US);
Inventor:
Cornelis Leo Hans Thieme, Westborough, MA (US);
Assignee:
American Superconductor Corporation, Ayer, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10N 60/01 (2023.01); C25D 1/04 (2006.01); C25D 1/20 (2006.01); C25D 5/00 (2006.01); C30B 19/00 (2006.01); C30B 30/02 (2006.01);
U.S. Cl.
CPC ...
H10N 60/0604 (2023.02); C25D 1/04 (2013.01); C25D 1/20 (2013.01); C25D 5/617 (2020.08); C30B 19/00 (2013.01); C30B 30/02 (2013.01); H10N 60/0241 (2023.02); H10N 60/0324 (2023.02); C25D 5/611 (2020.08);
Abstract
A process for producing a cube textured foil is described. The process includes providing a cube textured metal foil M. The process further includes electroplating an epitaxial layer of an alloy on the foil M, whereby the epitaxial layer substantially replicates the cube texture of the metal foil M. The process further includes electroplating a non-epitaxial layer of an alloy on the epitaxial layer. The process further includes separating the electroplated alloy from the cube textured metal foil M to obtain an electro-formed alloy with one cube textured surface.